Solutions de epoxy-resin-adhesive
Epoxy adhesives and resins are available in one-component and two-component bases. The one-component resin cures at high temperatures, while the two-component resin cures at room temperature. The adhesive offers a real alternative to conventional joining processes such as riveting, welding or brazing. To increase your productivity, the two-component epoxy adhesive can accelerate its curing by passing through an oven. In the smart card industry, single-component adhesives use Flip Chip technology.
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Epoxy resin adhesive
Notre savoir faire
Joining by bonding
Today, the challenges of bonding go beyond the choice of an adhesive or a dispensing equipment. The implementation and integration of a bonding process on a production line are essential to enable you to achieve optimum productivity.
With its know-how, SUPRATEC Syneo has been developing complete solutions integrated on the production lines of the largest industrial sites for 20 years.
Our Bonding experience
